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SILICON WAFER
Tape Edge Polisher
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The quality demand on form and
surface precision for wafer bevel and notch keeps increasing
with the launching of 300mm wafers.
MIPOX Tape Edge Polisher made
further refinements form by our delivery records of over 100
machines and gained the performance to meet the demand.
Product Features
- Environmentally friendly
non-chemical process.
- Flexible polishing process
is possible by unique polishing mechanism.
- Shape can be highly
controlled.
- High selectivity of
polishing process.
- Polishing method by
polishing system makes easy consumable control.
- Stable process capability.
Product Lineup |
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Standard Type
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NME-8N Type
For 6inch, 8inch wafer |
NME-123 Type
For 8inch, 12inch wafer |
High Throughput
Type
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TUNeDGE HT Type
For 12inch wafer |
Advantages of HT type compared tp
Standard Type:
Products Specification:
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ST（Standard） NME-8
Type |
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ST（Standard）
NME-123 Type |
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HT（High
Throughput） TUNeDGE HT Type |
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COMPACT EDGE
POLISHER - SYO Series
| Excellent wafer
edge geometry control can be achieved by the combination of
MIPOX Wafer Edge Polisher’s machine capability, and our vast
experience in Polishing Tapes
Product Features
- Compact Desktop Tool
- 2”~8” wafer size
- For Bevel polishing and
Orientation Flat polishing
- Manual Polisher
- Easy utility hookup
- Low Cost / High Performance
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Products Specification:
Malaysia
regional sales office :
MIPOX MALAYSIA SDN. BHD
(Wholly owned
subsidiary of Nihon Micro Coating)
No 12, 14 & 16,
Lintang Bayan Lepas 2,
Bayan Lepas Industrial
Park, Phase 4,
11900 Bayan Lepas,
Penang, Malaysia.
Phone: 604-642-8371
Fax: 604-6428508
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